Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

Page 5 of 6 March 2005

AG403-86

InGaP HBT Gain Block

Product Information

AG403-86 (SOT-86 Package) Mechanical Information

This package may contain lead-bearing materials. The plating material on the leads is SnPb.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

qC

233

qC/W

143

qC

1. The thermal resistance is referenced from the hottest part

of the junction to the ground lead (pin 2 or 4).

2. This corresponds to the typical biasing condition of

+4.91V, 60 mA at an 85 C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 177 C.

Product Marking

The component will be marked with a “G”

designator followed by a two-digit numeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 0

Value:

Passes at 150 V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class II

Value:

Passes at 250 V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 1

Standard:

JEDEC Standard J-STD-020A

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80 / .0135” )

diameter drill and have a final plated thru diameter of .25 mm

(.010” ).

2. Add as much copper as possible to inner and outer layers near

the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

MTTFvs. GNDLeadTemperature

1

10

100

1000

60

70

80

90

100

110

120

GroundLeadTemperature(°C)