2. Land Dimensions

　Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.

(in mm)

Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.

Table 2 Reflow Soldering Method

1.0×0.5

(within ±0.10)

1.0×0.5

（±0.20）

1.6×0.8

(±0.10)

1.6×0.8

(±0.20)

2.0×1.25

(±0.15)

2.0×1.25

(±0.20)

3.2×1.6

(within±0.20)

3.2×1.6

(±0.30)

(in mm)

GC□

32

3.2×2.5

2.0 to 2.4

1.0 to 1.2

1.8 to 2.3

GC□

31

1.8 to 2.0

0.9 to 1.2

1.5 to 1.7

1.9 to 2.1

1.0 to 1.3

1.7 to 1.9

GC□

21

1.2

0.6 to 0.8

1.2 to 1.4

1.0 to 1.4

0.6 to 0.8

1.2 to 1.4

GC□

18

0.6 to 0.8

0.6 to 0.7

0.6 to 0.8

0.7 to 0.9

0.7 to 0.8

0.8 to 1.0

GC□

15

0.3 to 0.5

0.35 to 0.45

0.4 to 0.6

0.4 to 0.6

0.4 to 0.5

0.5 to 0.7

GC□

03

0.6×0.3

(±0.03)

0.2 to 0.25

0.2 to 0.3

0.25 to 0.35

Series

Chip　Dimension

(L/W)　Code

Chip(L×W)

(Dimensions

Tolerance)

a

b

c

GC□

31

3.2×1.6

2.2 to 2.6

1.0 to 1.1

1.0 to 1.4

GC□

21

2.0×1.25

1.0 to 1.2

0.9 to 1.0

0.8 to 1.1

GC□

18

1.6×0.8

0.6 to 1.0

0.8 to 0.9

0.6 to 0.8

Notice

Series

Chip　Dimension

(L/W)　Code

Chip(L×W)

a

b

c

b

a

Solder Resist

Chip Capacitor

Land

JEMCGC-2702S

24