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OPA388, OPA2388, OPA4388

SBOS777A – DECEMBER 2016 – REVISED JULY 2018

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Product Folder Links: OPA388 OPA2388 OPA4388

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA388

OPA388

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

116

177

°C/W

Junction-to-case (top) thermal resistance

60

69

°C/W

Junction-to-board thermal resistance

56

100

°C/W

Junction-to-top characterization parameter

12.8

9.9

°C/W

Junction-to-board characterization parameter

55.9

98.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2388

OPA2388

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

165

°C/W

Junction-to-case (top) thermal resistance

53

°C/W

Junction-to-board thermal resistance

87

°C/W

Junction-to-top characterization parameter

4.9

°C/W

Junction-to-board characterization parameter

85

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W