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ICS2309M-1 Datasheet(PDF) 3 Page - Integrated Circuit Systems |
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ICS2309M-1 Datasheet(HTML) 3 Page - Integrated Circuit Systems |
3 / 9 page 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER MDS 2309 D 3 Revision 052405 In te gr ated Circuit Systems ● 5 25 Race Stree t, San Jose, CA 951 26 ● te l (40 8) 2 97-12 01 ● www.icst.com ICS2309 External Components The ICS2309 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as close to the device as possible. A series termination resistor of 33 Ω may be used to each clock output pin to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions Item Rating Supply Voltage, VDD 7 V All Inputs and Outputs -0.5 V to VDD+0.5 V CLKIN and FBIN inputs -0.5 V to 5.5 V Electrostatic Discharge (HBM) 2000 V Ambient Operating Temperature (Commercial) 0 to +70 °C Ambient Operating Temperature (Industrial) -40 to +85 °C Storage Temperature -65 to +150 °C Junction Temperature 150 °C Soldering Temperature 260 °C Parameter Min. Typ. Max. Units Ambient Operating Temperature (Industrial) -40 +85 °C Ambient Operating Temperature (Commercial) 0 +70 °C Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V |
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Similar Description - ICS2309M-1 |
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