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SFC2309-200 Datasheet(PDF) 4 Page - Semtech Corporation

Part No. SFC2309-200
Description  Flip Chip TVS Diode with T-Filter for Color LCD Interface Protection
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Maker  SEMTECH [Semtech Corporation]
Homepage  http://www.semtech.com
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SFC2309-200 Datasheet(HTML) 4 Page - Semtech Corporation

 
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 2003 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC2309-200
Applications Information
Device Connection Options
The SFC2309-200 has solder bumps located in a 5 x 5
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 5 along the
horizontal axis and letters A - E along the vertical axis.
The input of the lines to be protected are connected at
bumps A1 - A5 and B1 - B5. The line outputs are
connected at bumps D1 - D5 and E1 - E5. Bumps C1 -
C5 are connected to ground. All path lengths should
be kept as short as possible to minimize the effects of
parasitic inductance in the board traces.
Wafer Level CSP TVS
CSP TVS devices are wafer level chip scale packages.
They eliminate external plastic packages and leads and
thus result in a significant board space savings. Manu-
facturing costs are minimized since they do not require
an intermediate level interconnect or interposer layer
for reliable operation. They are compatible with cur-
rent pick and place equipment further reducing manu-
facturing costs. Certain precautions and design
considerations have to be observed however for
maximum solder joint reliability. These include solder
pad definition, board finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting flip chip devices. Solder
mask defined (SMD) pads produce stress points at the
solder mask to solder ball interface that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.275 ±
0.010 mm with a minimum solder mask opening of
0.325 mm.
Grid Courtyard
The recommended grid placement courtyard is 2.7 x
2.7 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
Pin Identification and Configuration (Ball Side View)
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Layout Example (Ball Side View)
1
6273
8
4
9
5
10
61
728
3
9
4 10
5
Output
Input


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