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WS512K32NBV-15G2 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part No. WS512K32NBV-15G2
Description  512Kx32 3.3V SRAM MODULE
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Maker  ETC [List of Unclassifed Manufacturers]
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WS512K32NBV-15G2 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

   
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White Microelectronics • Phoenix, AZ • (602) 437-1520
4
WS512K32BV-XXXE
512Kx32 3.3V SRAM MODULE
PRELIMINARY*
s Commercial, Industrial and Military Temperature Ranges
s 3.3 Volt Power Supply
s BiCMOS
s TTL Compatible Inputs and Outputs
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WS512K32BV-XG2XE - 8 grams typical
WS512K32NBV-XH2XE - 13 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
This speed is Advanced information.
FEATURES
s Access Times of 15, 17, 20ns
s MIL-STD-883 Compliant Devices Available
s Low Voltage Operation
s Packaging
• 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP
(Package 402)
• 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square
(Package 500). Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint
s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8
s Radiation Tolerant with Epitaxial Layer Die
PIN CONFIGURATION FOR WS512K32NBV-XH2XE
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
TOP VIEW
BLOCK DIAGRAM
512K x 8
8
I/O 0-7
CS1
512K x 8
8
I/O 8-15
2
512K x 8
8
I/O 16-23
3
512K x 8
8
I/O 24-31
4
A 0-18
OE
WE
CS
WE
CS
WE
CS
WE
12
3
4
February 1998


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