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TPS72625KTTT Datasheet(PDF) 9 Page - Texas Instruments |
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TPS72625KTTT Datasheet(HTML) 9 Page - Texas Instruments |
9 / 16 page www.ti.com DDPAK Power Dissipation P Dmax + (5 * 2.5) V x 1 A + 2.5 W (5) RθJAmax + (125 * 55)°C 2.5 W + 28°C W (6) 15 20 25 30 35 40 0.1 1 10 100 Copper Heatsink Area − cm2 No Air Flow 150 LFM 250 LFM TPS726126 TPS72615, TPS72616 TPS72618, TPS72625 SLVS403F – MAY 2002 – REVISED MAY 2005 THERMAL INFORMATION (continued) The DDPAK package provides an effective means of managing power dissipation in surface mount applications. The DDPAK package dimensions are provided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the DDPAK package enhances the thermal performance of the package. To illustrate, the TPS72625 in a DDPAK package was chosen. For this example, the average input voltage is 5 V, the output voltage is 2.5 V, the average output current is 1 A, the ambient temperature 55°C, the air flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent current, the maximum average power is: Substituting TJmax for TJ into Equation 4 gives Equation 6: From Figure 20, DDPAK Thermal Resistance vs Copper Heatsink Area, the ground plane needs to be 1 cm2 for the part to dissipate 2.5 W. The operating environment used in the computer model to construct Figure 20 consisted of a standard JEDEC High-K board (2S2P) with a 1 oz. internal copper plane and ground plane. The package is soldered to a 2 oz. copper pad. The pad is tied through thermal vias to the 1 oz. ground plane. Figure 21 shows the side view of the operating environment used in the computer model. Figure 20. DDPAK Thermal Resistance vs Copper Heatsink Area 9 |
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