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PC7410 Datasheet(PDF) 16 Page - ATMEL Corporation |
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PC7410 Datasheet(HTML) 16 Page - ATMEL Corporation |
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16 / 54 page  16 PC7410 2141D–HIREL–02/04 Figure 7. Thermalloy #2328B Heat Sink-to-ambient Thermal Resistance vs. Airflow Velocity Assuming an air velocity of 0.5 m/s, the effective R sa is 7°C/W, thus , resulting in a die-junction temperature of approximately 75 °C which is well within the maximum operating temperature of the component. Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakefield Engineering and Aavid Engineering offer different heat sink-to-ambient thermal resistances and may or may not need air flow. Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure of merit used for comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution when only using this metric in determining thermal management because no single parameter can ade- quately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function of the component-level thermal resistance, but of the system-level design and its operating conditions. In addition to the component's power consumption, a number of factors affect the final operating die-junction temperature – airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc. 1 3 5 7 8 00.5 11.5 22.5 3 3.5 Thermalloy #2328B Pin-Fin Heat Sink (25 x 28 x 15 mm) Approach Air Velocity (m/s) 2 4 6 Tj 30 °C 5°C 0,03 °CW ⁄ 1,0 °CW ⁄ 7 °CW ⁄ ++ () 5W × ++ = |
Similar Part No. - PC7410 |
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Similar Description - PC7410 |
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