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LMV358AIDGKT Datasheet(PDF) 6 Page - Texas Instruments

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Part No. LMV358AIDGKT
Description  Low-Voltage Rail-to-Rail Output Operational Amplifiers
Download  37 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMV358AIDGKT Datasheet(HTML) 6 Page - Texas Instruments

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LMV321A, LMV358A, LMV324A
SBOS923B – DECEMBER 2017 – REVISED JUNE 2018
www.ti.com
Product Folder Links: LMV321A LMV358A LMV324A
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Copyright © 2017–2018, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Package is preview only.
6.4 Thermal Information: LMV321A
THERMAL METRIC (1)
LMV321A
UNIT
DBV (SOT-23)(2)
DCK (SC70)(2)
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
232.8
239.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
153.8
148.5
°C/W
RθJB
Junction-to-board thermal resistance
100.9
82.3
°C/W
ψJT
Junction-to-top characterization parameter
77.2
54.5
°C/W
ψJB
Junction-to-board characterization parameter
100.4
81.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Package is preview only.
6.5 Thermal Information: LMV358A
THERMAL METRIC(1)
LMV358A
UNIT
D (SOIC)
DGK (VSSOP)
PW (TSSOP)(2)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
147.4
201.2
205.8
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
94.3
85.7
106.7
°C/W
RθJB
Junction-to-board thermal resistance
89.5
122.9
133.9
°C/W
ψJT
Junction-to-top characterization parameter
47.3
21.2
34.4
°C/W
ψJB
Junction-to-board characterization parameter
89
121.4
132.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Package is preview only.
6.6 Thermal Information: LMV324A
THERMAL METRIC(1)
LMV324A
UNIT
D (SOIC)(2)
PW (TSSOP)(2)
14 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
102.1
148.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
56.8
68.1
°C/W
RθJB
Junction-to-board thermal resistance
58.5
92.7
°C/W
ψJT
Junction-to-top characterization parameter
20.5
16.9
°C/W
ψJB
Junction-to-board characterization parameter
58.1
91.8
°C/W


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