Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

GRM0225C1E4R1WA03 Datasheet(PDF) 17 Page - Murata Manufacturing Co., Ltd.

Part # GRM0225C1E4R1WA03
Description  Chip Monolithic Ceramic Capacitor for General
Download  30 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GRM0225C1E4R1WA03 Datasheet(HTML) 17 Page - Murata Manufacturing Co., Ltd.

Back Button GRM0225C1E4R1WA03 Datasheet HTML 13Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 14Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 15Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 16Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 17Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 18Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 19Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 20Page - Murata Manufacturing Co., Ltd. GRM0225C1E4R1WA03 Datasheet HTML 21Page - Murata Manufacturing Co., Ltd. Next Button
Zoom Inzoom in Zoom Outzoom out
 17 / 30 page
background image
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
[Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
[Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
Series
GRM
GRM
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
240 to 260℃
Chip Dimension(L/W) Code
01/02/03/15/18/21/31
32/43/55
ΔT≦190℃
Caution
Lead Free Solder
Peak Temperature
Air or N2
Atmosphere
ΔT≦130℃
Temperature Differential
!
Temperature(℃)
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCGC-2701X
17


Similar Part No. - GRM0225C1E4R1WA03

ManufacturerPart #DatasheetDescription
logo
Murata Manufacturing Co...
GRM0225C1E4R1WDAE MURATA-GRM0225C1E4R1WDAE Datasheet
50Kb / 1P
   Rated voltage
More results

Similar Description - GRM0225C1E4R1WA03

ManufacturerPart #DatasheetDescription
logo
Murata Manufacturing Co...
GR331AD72W103KW01 MURATA-GR331AD72W103KW01 Datasheet
695Kb / 25P
   Chip Monolithic Ceramic Capacitor for General
GRM31B5C2H821JW01 MURATA-GRM31B5C2H821JW01 Datasheet
1Mb / 28P
   Chip Monolithic Ceramic Capacitor for General
GRM31B5C2J681JW01 MURATA-GRM31B5C2J681JW01 Datasheet
1Mb / 28P
   Chip Monolithic Ceramic Capacitor for General
GRM152C80J224KE19 MURATA-GRM152C80J224KE19 Datasheet
838Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM0225C1E5R1WA03 MURATA-GRM0225C1E5R1WA03 Datasheet
836Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM152C80J224ME19 MURATA-GRM152C80J224ME19 Datasheet
838Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM0225C1E6R7WA03 MURATA-GRM0225C1E6R7WA03 Datasheet
836Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM152D70G104KE15 MURATA-GRM152D70G104KE15 Datasheet
838Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM0225C1E6R8WA03 MURATA-GRM0225C1E6R8WA03 Datasheet
836Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM21BR71H563KA01 MURATA-GRM21BR71H563KA01 Datasheet
828Kb / 30P
   Chip Monolithic Ceramic Capacitor for General
GRM31A5C2H100JW01 MURATA-GRM31A5C2H100JW01 Datasheet
1Mb / 28P
   Chip Monolithic Ceramic Capacitor for General
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com