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GRM0225C1E1R1WA03 Datasheet(PDF) 17 Page - Murata Manufacturing Co., Ltd. |
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GRM0225C1E1R1WA03 Datasheet(HTML) 17 Page - Murata Manufacturing Co., Ltd. |
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17 / 30 page  4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB. Preheating conditions are shown in table 1. It is required to keep the temperature differential between the solder and the components surface (ΔT) as small as possible. 2. Solderability of tin plating termination chips might be deteriorated when a low temperature soldering profile where the peak solder temperature is below the melting point of tin is used. Please confirm the solderability of tin plated termination chips before use. 3. When components are immersed in solvent after mounting, be sure to maintain the temperature difference (ΔT) between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time] shown in the table 1. Table 1 Series GRM GRM In the case of repeated soldering, the accumulated Recommended Conditions soldering time must be within the range shown above. Lead Free Solder: Sn-3.0Ag-0.5Cu 4. Optimum Solder Amount for Reflow Soldering 4-1. Overly thick application of solder paste results in a excessive solder fillet height. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack. 4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB. 4-3. Please confirm that solder has been applied smoothly to the termination. Make sure not to impose any abnormal mechanical shocks to the PCB. Inverting the PCB 240 to 260℃ Chip Dimension(L/W) Code 01/02/03/15/18/21/31 32/43/55 ΔT≦190℃ Caution Lead Free Solder Peak Temperature Air or N2 Atmosphere ΔT≦130℃ Temperature Differential ! Temperature(℃) Peak Temperature Soldering Gradual Cooling Preheating ΔT 60-120 seconds 30-60 seconds Time 190℃ 170℃ 150℃ 220℃ Soldering Time(s) 280 270 260 250 240 230 220 0 30 60 120 90 JEMCGC-2701X 17 |
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