9397 750 13357

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Preliminary data sheet

Rev. 01 — 1 October 2004

30 of 32

Philips Semiconductors

TDA8922B

2

× 50 W class-D power amplifier

16.4 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026); order a copy from your Philips

Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with

respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of

the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

[4]

Hot bar soldering or manual soldering is suitable for PMFP packages.

[5]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed

through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217

°C ± 10 °C

measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.

[6]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate

between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the

heatsink surface.

[7]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave direction. The package footprint

must incorporate solder thieves downstream and at the side corners.

[8]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for

packages with a pitch (e) equal to or smaller than 0.65 mm.

[9]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely

not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.

However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate

soldering profile can be provided on request.

17. Revision history

Table 11:

Suitability of IC packages for wave, reflow and dipping soldering methods

Mounting

Soldering method

Wave

Dipping

Through-hole mount

CPGA, HCPGA

suitable

−−

DBS, DIP, HDIP, RDBS, SDIP, SIL

−

suitable

Through-hole-surface

mount

not suitable

not suitable

−

Surface mount

TFBGA, VFBGA, XSON

not suitable

suitable

−

DHVQFN, HBCC, HBGA, HLQFP,

HSO, HSOP, HSQFP, HSSON,

HTQFP, HTSSOP, HVQFN,

HVSON, SMS

suitable

−

suitable

suitable

−

LQFP, QFP, TQFP

suitable

−

SSOP, TSSOP, VSO, VSSOP

suitable

−

not suitable

not suitable

−

Table 12:

Revision history

Document ID

Release date

Data sheet status

Change notice

Order number

Supersedes

TDA8922B_1

20041001

Preliminary data sheet

-

9397 750 13357

-