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GCM21BR72A103KA37 Datasheet(PDF) 26 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 26 Page - Murata Manufacturing Co., Ltd. |
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26 / 28 page  2.Adhesive Application 1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering. The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding strength. The chip's electrode thickness and land thickness must also be taken into consideration. a=20～ 70μm b=30～ 35μm c=50～ 105μm 2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of 5000Pa • s (500ps) min. (at 25℃) 3.Adhesive Coverage Part Number Adhesive Coverage* GC□18 0.05mg min. GC□21 0.1mg min. GC□31 0.15mg min. *Nominal Value 3.Adhesive Curing 1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes deterioration in the insulation resistance between the outer electrodes due to moisture absorption. Control curing temperature and time in order to prevent insufficient hardening. 4.Flux Application 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of Solderability. So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering). 2. Flux containing too a high percentage of halide may cause corrosion of the outer electrodes unless there is sufficient cleaning. Use flux with a halide content of 0.2% max. 3. Do not use strong acidic flux. 4. Do not use water-soluble flux. (*Water-soluble flux can be defined as non roｓin type flux including wash-type flux and non-wash-type flux.) 5.Flow Soldering Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown right) and 25% of the length A-B shown below as mounted on substrate. Notice Chip Capacitor Board Adhesive Land a b c A B D C Outer Electrode ［As a Single Chip］ ［As Mounted on Substrate］ A B JEMCGC-2702N 26 |
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