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GCM21BR72A103KA37 Datasheet(PDF) 25 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 25 Page - Murata Manufacturing Co., Ltd. |
25 / 28 page ![]() 2. Land Dimensions 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering. Please confirm the suitable land dimension by evaluating of the actual SET / PCB. Table 1 Flow Soldering Method Dimensions Part Number GC□31 3.2×1.6 2.2~2.6 1.0~1.1 1.0~1.4 (in mm) Table 2 Reflow Soldering Method Dimensions Part Number GC□31 3.2×1.6 2.2~2.4 0.8~0.9 1.0~1.4 GC□32 3.2×2.5 2.0~2.4 1.0~1.2 1.8~2.3 (in mm) GC□15 GC□18 GC□21 0.6~0.8 2.0×1.25 1.0~1.2 0.9~1.0 0.8~1.1 GC□18 Chip(L×W) GC□03 c 0.6×0.3 0.2~0.3 0.2~0.35 0.2~0.4 GC□21 1.6×0.8 0.6~1.0 Notice a b Chip(L×W) 0.6~0.7 0.6~0.8 a b c 0.8~0.9 2.0×1.25 1.0~1.2 0.6~0.7 0.8~1.1 1.0×0.5 0.3~0.5 0.35~0.45 0.4~0.6 1.6×0.8 0.6~0.8 Chip Capacitor Land Solder Resist a b C JEMCGC-2702N 25 |
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