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GCM21BR72A103KA37 Datasheet(PDF) 24 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 24 Page - Murata Manufacturing Co., Ltd. |
24 / 28 page ![]() ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height. 1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board. Please contact us if you want to use our ceramic capacitors on a metal board such as Aluminum. Pattern Forms Lateral Mounting Prohibited Correct Notice Placing Close to Chassis Placing of Chip Components and Leaded Components Placing of Leaded Components after Chip Component Chassis Solder (ground) Electrode Pattern Lead Wire Solder Resist Solder Resist Soldering Iron Lead Wire Solder Resist Solder Resist JEMCGC-2702N 24 |
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