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GCM21BR72A103KA37 Datasheet(PDF) 19 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 19 Page - Murata Manufacturing Co., Ltd. |
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19 / 28 page  4-3.Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip", "Preheating Temperature", "Temperature Differential" between the iron tip and the components and the PCB), should be within the conditions of table 3. It is required to keep the temperature differential between the soldering Iron and the component surfaces (ΔT) as small as possible. 2. After soldering, do not allow the component/PCB to rapidly cool down. 3. The operating time for the re-working should be as short as possible. When re-working time is too long, it may cause solder leaching, and that will cause a reduction in the adhesive strength of the terminations. Table 3 *Applicable for both Pb-Sn and Lead Free Solder.Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu 4. Optimum Solder amount when re-working with a Soldering lron 4-1. In case of sizes smaller than 0603, (GC□03/15/18), the top of the solder fillet should be lower than 2/3's of the thickness of the component or 0.5mm whichever is smaller. In case of 0805 and larger sizes, (GC□21/ 31/32), the top of the solder fillet should be lower than 2/3's of the thickness of the component. If the in section solder amount is excessive, the risk of cracking is higher during board bending or under any other stressful condition. 4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering iron from touching the components during the re-work. 4-3. Solder wire with ø0.5mm or smaller is required for soldering. 4-4.Leaded Component Insertion 1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted, chips may crack and solder joints may break. Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping. Caution 150℃ min. ΔT≦190℃ Air Part Number Temperature of Soldering Iron tip ΔT≦130℃ Air Preheating Temperature GC□03/15/18/21/31 Temperature Differential (ΔT) Atmosphere GC□32 280℃ max. 150℃ min. 350℃ max. Solder Amount ! JEMCGC-2702N 19 |
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