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GCM21BR72A103KA37 Datasheet(PDF) 17 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 17 Page - Murata Manufacturing Co., Ltd. |
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17 / 28 page  4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board. Preheating conditions are shown in table 1. It is required to keep the temperature differential between the solder and the components surface (ΔT) as small as possible. 2. Solderability of Tin plating termination chips might be deteriorated when a low temperature soldering profile where the peak solder temperature is below the melting point of Tin is used. Please confirm the Solderability of Tin plated termination chips before use. Vapor Reflow 3. When components are immersed in solvent after mounting, be sure to maintain the temperature difference (ΔT) between the component and the solvent within the range shown in the table 1. Table 1 GC□03/15/18/21/31 [Allowable Soldering Temperature and Time] GC□32 Recommended Conditions Infrared Reflow Vapor Reflow Peak Temperature 230～250℃ 230～240℃ 240～260℃ Atmosphere Air Air Air or N2 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu In case of repeated soldering, the accumulated soldering time must be within the range shown above. 4. Optimum Solder Amount for Reflow Soldering 4-1. Overly thick application of solder paste results in a excessive solder fillet height. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack. * GC□03: 1/3 of Chip Thickness min. 4-2. Too little solder paste results in a lack of adhesive in section strength on the outer electrode, which may result in chips breaking loose from the PCB. 4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm* min. Make sure not to impose any abnormal mechanical shocks to the PCB. Inverting the PCB Caution Part Number Temperature Differential ΔT≦190℃ ΔT≦130℃ Pb-Sn Solder Lead Free Solder 0.2mm* min. ! Soldering Soldering 60-120 seconds 60-120 seconds 30-60 seconds 20 seconds 280 270 260 250 240 230 220 Time Time Temperature(℃) Peak Temperature 200℃ 170℃ 150℃ 130℃ Gradual Cooling Temperature(℃) Peak Temperature 170℃ 150℃ 130℃ Gradual Cooling 0 30 60 90 120 Soldering Time(sec.) Preheating Preheating JEMCGC-2702N 17 |
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