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GCM21BR72A103KA37 Datasheet(PDF) 5 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A103KA37 Datasheet(HTML) 5 Page - Murata Manufacturing Co., Ltd. |
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5 / 28 page  Temperature Compensating Type High Dielectric Type 18 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using a eutectic solder. Then apply a force in the direction shown in Fig 2 for 5±1sec. The soldering should be done by the reflow method and should be conducted with care so that the Capacitance Within ±5.0% or ±0.5pF R7/L8/R9: Within ±10.0% soldering is uniform and free of defects such as heat shock. Change (Whichever is larger) Q/D.F. 30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. 30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035max. C: Nominal Capacitance(pF) R9 : 0.05max. I.R. More than 10,000M Ω or 500Ω ・F (Whichever is smaller) 19 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with Capacitance Within specified tolerance the test jig for 60sec. Change The soldering should be done either with an iron or using the reflow Q/D.F. 30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. method and should be conducted with care so that the soldering is 30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035max. uniform and gree of defects such as heat shock C: Nominal Capacitance(pF) R9 : 0.05max. I.R. More than 10,000M Ω or 500Ω ・F (Whichever is smaller) （in mm） 20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4. < Chip L dimension : 2.5mm max. > Apply a force. < Chip Length : 2.5mm max. > < Chip L dimension : 3.2mm max. > < Chip Length : 3.2mm min. > Speed supplied the Stress Load : *0.5mm / sec. *GCM03: 0.1mm/sec. Chip thickness < 1.25mm rank : 15N Chip thickness ≧1.25mm rank : 54.5N Chip thickness > 0.5mm rank : 20N Chip thickness ≦0.5mm rank : 8N ■AEC-Q200 Murata Standard Specification and Test Methods No AEC-Q200 Test Item AEC-Q200 Test Method Specification. t : 1.6mm Fig.3 Fig.4 *2N(GCM03/15) (GCM03/15:0.8mm Type a b c GCM03 0.3 0.9 0.3 GCM15 0.5 1.5 0.6 GCM18 0.6 2.2 0.9 GCM21 0.8 3.0 1.3 GCM31 2.0 4.4 1.7 GCM32 2.0 4.4 2.6 (in mm) ＊2 4.0±0.1 0.05以下 ＊1 φ1.5 +0.1 -0 Ａ t *1,2：2.0±0.05 100 a b f4.5 Fig.1 Type a b c GCM03 0.3 0.9 0.3 GCM15 0.4 1.5 0.5 GCM18 1.0 3.0 1.2 GCM21 1.2 4.0 1.65 GCM31 2.2 5.0 2.0 GCM32 2.2 5.0 2.9 ＊2 4.0±0.1 0.05以下 ＊1 φ1.5+0.1 -0 Ａ t *1,2：2.0±0.05 a b ﾗﾝﾄﾞ f4.5 c Solder resist Baked electrode or Copper foil t: 1.6mm (GCM03/15: 0.8mm) Iron Board 45 45 Flexure：≦2 (High Dielectric Type) Capacitance meter Pressurizing speed:1.0mm/s Pressurize 支持台 ｺﾝﾃﾞﾝｻ 45 45 Fig.2 Flexure：≦3 (Temperature Compensating Type) R4 20 114 L 0.6L JEMCGS-0363S 5 |
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