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NCP5214 Datasheet(PDF) 1 Page - ON Semiconductor |
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NCP5214 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 14 page © Semiconductor Components Industries, LLC, 2005 April, 2005 − Rev. P0 1 Publication Order Number: NCP5214/D NCP5214 Product Preview 2−in−1 Notebook DDR Power Controller The NCP5214 2−in−1 Notebook DDR Power Controller is specifically designed as a total power solution for notebook DDR memory system. This IC combines the efficiency of a PWM controller for the VDDQ supply with the simplicity of linear regulators for the VTT termination voltage and the buffered low noise reference. This IC contains a synchronous PWM buck controller for driving two external NFETs to form the DDR memory supply voltage (VDDQ). The DDR memory termination regulator output voltage (VTT) and the buffered VREF are internally set to track at the half of VDDQ. An internal power good voltage monitor tracks VDDQ output and notifies the user whether the VDDQ output is within target range. Protective features include soft−start circuitries, undervoltage monitoring of supply voltage, VDDQ overcurrent protection, VDDQ overvoltage and undervoltage protections, and thermal shutdown. The IC is packaged in DFN−22. Features • Incorporates VDDQ, VTT Regulator, Buffered VREF • Adjustable VDDQ Output • VTT and VREF Track VDDQ/2 • Operates from Single 5.0 V Supply • Supports VDDQ Conversion Rails from 5.0 V to 24 V • Power−saving Mode for High Efficiency at Light Load • Integrated Power FETs with VTT Regulator Sourcing/Sinking 1.5 A DC and 2.4 A Peak Current • Buffered Low Noise 15 mA VREF Output • All External Power MOSFETs are N−channel • <5.0 mA Current Consumption During Shutdown • Fixed Switching Frequency of 400 kHz • Soft−start Protection for VDDQ and VTT • Undervoltage Monitor of Supply Voltage • Overvoltage Protection and Undervoltage Protection for VDDQ • Short−circuit Protection for VDDQ and VTT • Thermal Shutdown • Housed in DFN−22 Typical Applications • Notebook DDR/DDR2 Memory Supply and Termination Voltage • Active Termination Busses (SSTL−18, SSTL−2, SSTL−3) This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. DFN−22 MN SUFFIX CASE 506AF PIN CONNECTIONS Device Package Shipping† ORDERING INFORMATION NCP5214MNR2 DFN−22 2500 Tape & Reel NCP5214 = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week MARKING DIAGRAM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com VDDQEN VTTEN FPWM SS VTTGND VTT VTTI FBVTT AGND DDQREF VCCA PGND BGDDQ VCCP SWDDQ TGDDQ BOOST OCDDQ PGOOD VTTREF FBDDQ COMP (Top View) NOTE: Pin 23 is the thermal pad on the bottom of the device. NCP5214 AWLYYWW 1 1 22 |
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