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ASMG-PT00-00001 Datasheet(PDF) 11 Page - Broadcom Corporation.
BOARDCOM [Broadcom Corporation.]
ASMG-PT00-00001 Datasheet(HTML) 11 Page - Broadcom Corporation.
/ 13 page
ASMG-PT00-00001 Data Sheet
1W Tri-Color High Power LED
Recommended reflow soldering conditions:
Figure 18: Recommended Reflow Soldering Profile
Do not perform reflow soldering more than twice.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Hot plate
should only be used for rework if unavoidable but must
be strictly controlled to the following conditions:
– LED temperature = 260°C max.
– Time at maximum temperature = 20s max.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
Hand soldering is not recommended.
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Do refer to Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions for more information.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and induce failures to the LED die or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting too
much pressure on the silicone. Ultrasonic cleaning is
For automated pick-and-place, Broadcom has tested
the following nozzle size to work well with this LED.
However, due to the possibility of variations in other
parameters, such as pick-and-place machine maker/
model and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
Figure 19: Nozzle Size
The soldering terminals of these LEDs are silver plated.
If the LEDs are exposed in an ambient environment for
too long, the silver plating might be oxidized and thus
affecting its solderability performance. As such, keep
unused LEDs in a sealed moisture barrier bag (MBB)
with desiccant or in desiccator at <5%RH.
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
(Acc. to J-STD-020C)
60 - 120 SEC.
3 C/SEC. MAX.
255 - 260 C
100 SEC. MAX.
10 - 30 SEC.
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