ISL54062

FN6581 Rev 1.00

Page 16 of 16

Nov 3, 2009

Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)

6

B

E

A

D

0.10 C

2X

C

0.05 C

A

0.10 C

A1

SEATING PLANE

INDEX AREA

2

1

N

TOP VIEW

SIDE VIEW

NX (b)

SECTION "C-C"

e

CC

5

CL

TERMINAL TIP

(A1)

L

0.10 C

2X

L1

e

NX L

BOTTOM VIEW

5

7

2

1

PIN #1 ID

(DATUM A)

(DATUM B)

0.10 M C A B

0.05 M C

NX b

10X

5

0.50

0.20

0.40

1.80

0.40

0.20

2.20

1.00

0.60

1.00

LAND PATTERN

10

L10.1.8x1.4A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC

PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

5

D

1.75

1.80

1.85

-

E

1.35

1.40

1.45

-

e

0.40 BSC

-

L

0.35

0.40

0.45

-

L1

0.45

0.50

0.55

-

N10

2

Nd

2

3

Ne

3

3



0-

12

4

Rev. 3 6/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on D and E side,

respectively.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. JEDEC Reference MO-255.

10. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.