SSOP24 (225mil)

CASE 565AR

ISSUE A

DATE 23 OCT 2013

XXXXXXXXXX

YMDDD

XXXXX = Specific Device Code

Y = Year

M = Month

DDD = Additional Traceability Data

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

SOLDERING FOOTPRINT*

NOTE: The measurements are not to guarantee but for reference only.

(Unit: mm)

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

1.0

5.80

0.32

0.50

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON66069E

ON SEMICONDUCTOR STANDARD

SSOP24 (225MIL)

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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