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LA6583MC-W-AH Datasheet(PDF) 5 Page - ON Semiconductor |
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LA6583MC-W-AH Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 8 page LA6583MC www.onsemi.com 5 APPLICATION CIRCUIT EXAMPLE Figure 3. Application Circuit Example HB Di IN+ IN− HB IN+ IN− Cr GND VCC RD FG OUT1 OUT2 R2 *1 *2 *5 *4 *3 Elements in Substrate H R1 H LA6583MC *1: When Di to prevent breakdown in case of reverse connection is used, it is necessary to insert a capacitor Cr to secure the regenerative current route. Similarly, Cr is necessary to enhance the reliability when there is no capacitor near the fan power line. *2: When the Hall bias is taken from the HB pin, constant-voltage bias is made with about 1.3 V. Therefore, the Hall output becomes the stable amplitude voltage satisfactory in temperature characteristics. By inserting R2 to obtain the Hall bias from both VCC and HB, as shown in the figure, heat generation of IC can be suppressed. *3: In this IC, the Hall output amplitude is amplified to produce the drive waveform. Therefore, the switching time of the current application direction is determined by the Hall output, causing change in the characteristics of motor. If the Hall element output amplitude is large, the start-up performance and efficiency of the IC are improved. On the other hand, if the Hall element output amplitude is small, low-noise drive is ensured. Adjust the Hall element output amplitude by R1. *4: Keep this open when this is not used. *5: When the wiring from the Hall output to IC Hall input is long, noise may be carried through the wiring. In this case, insert the capacitor as shown in the figure. ORDERING INFORMATION Device Package Wire Bond Shipping† (Qty / Packing) LA6583MC−AH MFP10SK (225mil) Au−wire 1,000 / Tape & Reel LA6583MC−W−AH MFP10SK (225mil) Cu−wire 1,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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