NCV7703C

www.onsemi.com

4

MAXIMUM RATINGS

Rating

Value

Unit

(DC)

(AC), t < 500 ms, Ivs > −2 A

−0.3 to 40

−1

V

Output Pin OUTx

(DC)

(AC), t < 500 ms, IOUTx > −2 A

−0.3 to 40

−1

V

Pin Voltage

−0.3 to 5.5

V

Output Current (OUTx)

(DC)

(AC) (50 ms pulse, 1 s period)

−1.8 to 1.8

−5.0 to 5.0

A

Electrostatic Discharge, Human Body Model,

6

kV

Electrostatic Discharge, Human Body Model,

all other pins (Note 3)

2

kV

Electrostatic Discharge, Machine Model,

300

V

Electrostatic Discharge, Machine Model,

all other pins (Note 3)

200

V

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−55 to 150

°C

Moisture Sensitivity Level (MAX 260

°C Processing)

MSL3

−

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

Thermal Parameters

Test Conditions (Typical Value)

Unit

14 Pin Fused SOIC Package

min−pad board

(Note 1)

1

″ pad board

(Note 2)

Junction−to−Lead (psi−JL8,

23

22

°C/W

122

83

°C/W

″ thick FR4.

″ thick FR4.

3. This device series incorporates ESD protection and is characterized by the following methods:

ESD HBM according to AEC−Q100−002 (EIA/JESD22−A114)

ESD MM according to AEC−Q100−003 (EIA/JESD22−A115)