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GNM1M2R71E103MA01 Datasheet(PDF) 22 Page - Murata Manufacturing Co., Ltd. |
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GNM1M2R71E103MA01 Datasheet(HTML) 22 Page - Murata Manufacturing Co., Ltd. |
22 / 24 page 2. Land Dimensions 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for reflow soldering. Please confirm the suitable land dimension by evaluating of the actual SET / PCB. GNM□□2 GNM□□4 Table 1 Reflow Soldering Method Dimensions Part Number GNM0M2 0.9×0.6 0.12 to 0.20 ** 0.35 to 0.40 ** 0.30 0.45 GNM1M2 1.37×1.0 0.4 to 0.5 * 0.35 to 0.45 * 0.3 to 0.35 0.64 GNM212 2.0×1.25 0.6 to 0.7 0.5 to 0.7 0.4 to 0.5 1.0 GNM214 2.0×1.25 0.6 to 0.7 0.5 to 0.7 0.25 to 0.35 0.5 GNM314 3.2×1.6 0.8 to 1.0 0.7 to 0.9 0.3 to 0.4 0.8 (in mm) * a+2b < 1.35 ** 0.82≦a+2b≦1.0 c p Notice L×W a b JEMCCC-0010Q 22 |
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