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GNM0M2R61C104ME18 Datasheet(PDF) 3 Page - Murata Manufacturing Co., Ltd.

Part No. GNM0M2R61C104ME18
Description  CHIP MONOLITHIC CERAMIC CAPACITOR, CAPACITOR ARRAYS FOR GENERAL
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Maker  MURATA [Murata Manufacturing Co., Ltd.]
Homepage  http://www.murata.com
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GNM0M2R61C104ME18 Datasheet(HTML) 3 Page - Murata Manufacturing Co., Ltd.

 
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11 Vibration
Appearance
No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) in the
Resistance
same manner and under the same conditions as (10).
Capacitance
Within the specified tolerance.
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Q/D.F.
B1,B3,R6 : 0.1max.
uniformly between the approximate limits of 10 and 55Hz. The
*3 However 0.125 max. about Table 2 items.
frequency range, from 10 to 55Hz and return to 10Hz, should be
F1 : 0.2max
traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each 3 mutually perpendicular
directions(total of 6 hours).
12 Deflection
Appearance
No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig.1 using an eutectic solder. Then apply a force in the direction
Capacitance
Within ±10%
shown in Fig 2 for 5±1 seconds. The soldering should be done
Change
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
13 Solderability
75% of the terminations is to be soldered evenly
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
of Termination
and continuously.
rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃ for 10 to 30 seconds.
After preheating , immerse in eutectic solder solution for 2±0.5
seconds at 230±5℃ or Sn-3.0Ag-0.5Cu solder solution for 2±0.5
seconds at 245±5℃.
14 Resistance to
The measured and observed characteristics should satisfy
Preheat the capacitor at 120 to 150℃ for 1 minute.
Soldering Heat
the specifications in the following table.
Immerse the capacitor in an eutectic solder solution or
Appearance
No marking defects.
Sn-3.0Ag-0.5Cu solder solution at 270±5℃ for
Capacitance
B1,B3,R6 :Within ±7.5%
10±0.5 seconds.
Change
F1
:Within ±20%
Let sit at room temperature for 24±2 hours, then measure.
GNM0M2B3/R60G105:Within ±15%
GNM1M2R60J475:Within ±17%
Q/D.F.
B1,B3,R6 : 0.1max.
· Initial measurement for high dielectric constant type
*3 However 0.125 max. about Table 2 items.
Perform a heat treatment at 150+0/-10
C for one hour and
F1 : 0.2max
then set at room temperature for 24±2 hours.
Perform the initial measurement.
I.R.
More than 50Ω・F
Dielectric
No failure
Strength
15 Temperature
The measured and observed characteristics should satisfy
Fix the capacitor to the supporting jig in the same
Sudden Change
the specifications in the following table.
manner and under the same conditions as (10).
Perform the five cycles according to the four heat
Appearance
No marking defects.
treatments shown in the following table.
Set for 24±2 hours at room temperature, then measure.
Capacitance
B1,B3,R6 :Within ±7.5%
Change
GNM1M2R60J475:Within ±15%
F1
:Within ±20%
Q/D.F.
B1,B3,R6 : 0.1max.
*3 However 0.125 max. about Table 2 items.
F1 : 0.2max
I.R.
More than 50Ω・F
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
C for one hour and then
Dielectric
No failure
set at room temperature for 24±2 hours.
Strength
Perform the initial measurement.
■SPECIFICATIONS AND TEST METHODS
No
Item
Test Method
High Dielectric Type
Step
Temp.(
C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
JEMCCS-0013M
3


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