HIP6006

FN4306 Rev.3.00

Page 8 of 12

April 1, 2005

careful not to add inductance in the circuit board wiring that

could cancel the usefulness of these low inductance

components. Consult with the manufacturer of the load on

specific decoupling requirements. For example, Intel

recommends that the high frequency decoupling for the

Pentium Pro be composed of at least forty (40) 1.0

F ceramic

capacitors in the 1206 surface-mount package.

Use only specialized low-ESR capacitors intended for

switching-regulator applications for the bulk capacitors. The

bulk capacitor’s ESR will determine the output ripple voltage

and the initial voltage drop after a high slew-rate transient. An

aluminum electrolytic capacitor's ESR value is related to the

case size with lower ESR available in larger case sizes.

However, the equivalent series inductance (ESL) of these

capacitors increases with case size and can reduce the

usefulness of the capacitor to high slew-rate transient

loading. Unfortunately, ESL is not a specified parameter.

Work with your capacitor supplier and measure the

capacitor’s impedance with frequency to select a suitable

component. In most cases, multiple electrolytic capacitors of

small case size perform better than a single large case

capacitor.

Output Inductor Selection

The output inductor is selected to meet the output voltage

ripple requirements and minimize the converter’s response

time to the load transient. The inductor value determines the

converter’s ripple current and the ripple voltage is a function of

the ripple current. The ripple voltage and current are

approximated by the following equations:

Increasing the value of inductance reduces the ripple current

and voltage. However, the large inductance values reduce the

converter’s response time to a load transient.

One of the parameters limiting the converter’s response to a

load transient is the time required to change the inductor

current. Given a sufficiently fast control loop design, the

HIP6006 will provide either 0% or 100% duty cycle in response

to a load transient. The response time is the time required to

slew the inductor current from an initial current value to the

transient current level. During this interval the difference

between the inductor current and the transient current level

must be supplied by the output capacitor. Minimizing the

response time can minimize the output capacitance required.

The response time to a transient is different for the application

of load and the removal of load. The following equations give

the approximate response time interval for application and

removal of a transient load:

response time to the removal of load. With a +5V input source,

the worst case response time can be either at the application

or removal of load and dependent upon the output voltage

setting. Be sure to check both of these equations at the

minimum and maximum output levels for the worst case

response time.

Input Capacitor Selection

Use a mix of input bypass capacitors to control the voltage

overshoot across the MOSFETs. Use small ceramic capacitors

for high frequency decoupling and bulk capacitors to supply the

current needed each time Q1 turns on. Place the small ceramic

capacitors physically close to the MOSFETs and between the

drain of Q1 and the source of Q2.

The important parameters for the bulk input capacitor are the

voltage rating and the RMS current rating. For reliable

operation, select the bulk capacitor with voltage and current

ratings above the maximum input voltage and largest RMS

current required by the circuit. The capacitor voltage rating

should be at least 1.25 times greater than the maximum input

voltage and a voltage rating of 1.5 times is a conservative

guideline. The RMS current rating requirement for the input

capacitor of a buck regulator is approximately 1/2 the DC load

current.

For a through hole design, several electrolytic capacitors

(Panasonic HFQ series or Nichicon PL series or Sanyo MV-GX

or equivalent) may be needed. For surface mount designs,

solid tantalum capacitors can be used, but caution must be

exercised with regard to the capacitor surge current rating.

These capacitors must be capable of handling the surge-

current at power-up. The TPS series available from AVX, and

the 593D series from Sprague are both surge current tested.

MOSFET Selection/Considerations

The HIP6006 requires 2 N-Channel power MOSFETs. These

requirements, and thermal management requirements.

In high-current applications, the MOSFET power dissipation,

package selection and heatsink are the dominant design

factors. The power dissipation includes two loss components;

conduction loss and switching loss. The conduction losses are

the largest component of power dissipation for both the upper

and the lower MOSFETs. These losses are distributed

between the two MOSFETs according to duty factor (see the

equations below). Only the upper MOSFET has switching

losses, since the Schottky rectifier clamps the switching node

before the synchronous rectifier turns on.

These equations assume linear voltage-current transitions and

do not adequately model power loss due the reverse-recovery

of the lower MOSFETs body diode. The gate-charge losses are

dissipated by the HIP6006 and don't heat the MOSFETs.

However, large gate-charge increases the switching interval,

I =

Fs x L

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