HIP6004B

FN4567 Rev 3.00

Page 2 of 15

November 9, 2004

Pinouts

HIP6004B (SOIC, TSSOP)

TOP VIEW

HIP6004B (QFN)

TOP VIEW

11

12

13

14

15

16

17

18

20

19

10

9

8

7

6

5

4

3

2

1

OCSET

SS

VID0

VID1

VID2

VID4

VID3

COMP

FB

RT

LGATE

PGND

OVP

BOOT

UGATE

PHASE

PGOOD

GND

VID0

VID2

VID3

VID1

VID4

VCC

PGND

BOOT

LGATE

UGATE

1

2

3

4

5

678

9

10

15

14

13

12

11

20

19

18

17

16

GND

21

Ordering Information

PART NUMBER

TEMP.

RANGE (°C)

PACKAGE

PKG.

DWG. #

HIP6004BCB*

0 to 70

20 Ld SOIC

M20.3

HIP6004BCBZ*

(See Note)

0 to 70

20 Ld SOIC

(Pb-free)

M20.3

HIP6004BCV*

0 to 70

20 Ld TSSOP

M20.173

HIP6004BCVZ*

(See Note)

0 to 70

20 Ld TSSOP

(Pb-free)

M20.173

HIP6004BCVZA*

(See Note)

20 Ld TSSOP Tape and Reel

(Pb-free)

M20.173

HIP6004BCR*

0 to 70

20 Ld 5x5 QFN

L20.5x5

HIP6004BCRZ*

(See Note)

0 to 70

20 Ld 5x5 QFN

(Pb-free)

L20.5x5

*Add “-T” suffix to part number for tape and reel packaging.

NOTE: Intersil Pb-free products employ special Pb-free material

sets; molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and compatible

with both SnPb and Pb-free soldering operations. Intersil Pb-free

products are MSL classified at Pb-free peak reflow temperatures that

meet or exceed the Pb-free requirements of IPC/JEDEC J STD-

020C.

HIP6004B