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F3L200R12W2H3_B11 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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F3L200R12W2H3_B11 Datasheet(HTML) 2 Page - Infineon Technologies AG |
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2 / 14 page  2 TechnischeInformation/TechnicalInformation F3L200R12W2H3_B11 IGBT-Modul IGBT-Module preparedby:CM approvedby:AKDA dateofpublication:2016-04-04 revision:V3.1 IGBT,T1/T4/IGBT,T1/T4 HöchstzulässigeWerte/MaximumRatedValues Kollektor-Emitter-Sperrspannung Collector-emittervoltage Tvj = 25°C VCES 1200 V ImplementierterKollektor-Strom Implementedcollectorcurrent ICN 200 A Kollektor-Dauergleichstrom ContinuousDCcollectorcurrent TC = 100°C, Tvj max = 175°C IC nom 100 A PeriodischerKollektor-Spitzenstrom Repetitivepeakcollectorcurrent tP = 1 ms ICRM 400 A Gesamt-Verlustleistung Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 600 W Gate-Emitter-Spitzenspannung Gate-emitterpeakvoltage VGES +/-20 V CharakteristischeWerte/CharacteristicValues min. typ. max. Kollektor-Emitter-Sättigungsspannung Collector-emittersaturationvoltage IC = 100 A, VGE = 15 V IC = 100 A, VGE = 15 V IC = 100 A, VGE = 15 V VCE sat 1,55 1,70 1,75 1,75 V V V Tvj = 25°C Tvj = 125°C Tvj = 150°C Gate-Schwellenspannung Gatethresholdvoltage IC = 7,60 mA, VCE = VGE, Tvj = 25°C VGEth 5,05 5,80 6,45 V Gateladung Gatecharge VGE = -15 V ... +15 V QG 1,60 µC InternerGatewiderstand Internalgateresistor Tvj = 25°C RGint 3,8 Ω Eingangskapazität Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 11,5 nF Rückwirkungskapazität Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,70 nF Kollektor-Emitter-Reststrom Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 1,0 mA Gate-Emitter-Reststrom Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 100 nA Einschaltverzögerungszeit,induktiveLast Turn-ondelaytime,inductiveload IC = 100 A, VCE = 400 V VGE = ±15 V RGon = 1,1 Ω td on 0,14 0,155 0,16 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Anstiegszeit,induktiveLast Risetime,inductiveload IC = 100 A, VCE = 400 V VGE = ±15 V RGon = 1,1 Ω tr 0,025 0,03 0,03 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Abschaltverzögerungszeit,induktiveLast Turn-offdelaytime,inductiveload IC = 100 A, VCE = 400 V VGE = ±15 V RGoff = 1,1 Ω td off 0,32 0,40 0,42 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Fallzeit,induktiveLast Falltime,inductiveload IC = 100 A, VCE = 400 V VGE = ±15 V RGoff = 1,1 Ω tf 0,03 0,055 0,06 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C EinschaltverlustenergieproPuls Turn-onenergylossperpulse IC = 100 A, VCE = 400 V, LS = 25 nH VGE = ±15 V, di/dt = 3700 A/µs (Tvj = 150°C) RGon = 1,1 Ω Eon 1,20 2,00 2,25 mJ mJ mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C AbschaltverlustenergieproPuls Turn-offenergylossperpulse IC = 100 A, VCE = 400 V, LS = 25 nH VGE = ±15 V, du/dt = 2700 V/µs (Tvj = 150°C) RGoff = 1,1 Ω Eoff 3,50 5,30 5,90 mJ mJ mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C Kurzschlußverhalten SCdata VGE ≤ 15 V, VCC = 800 V VCEmax = VCES -LsCE ·di/dt ISC 800 A Tvj = 150°C tP ≤ 10 µs, Wärmewiderstand,ChipbisGehäuse Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 0,200 0,250 K/W |
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