4

OPA145

SBOS427B – JUNE 2017 – REVISED MAY 2018

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

Dual supply

±20

V

Single supply

40

Voltage

(V–) – 0.5

(V+) + 0.5

Current

±10

mA

Continuous

Continuous

–55

150

°C

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, (V+) – (V–)

Dual supply

±2.25

±15

±18

V

Single supply

4.5

30

36

Ambient temperature

–40

25

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA145

OPA145

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT)

8 PINS

8 PINS

5 PINS

Junction-to-ambient thermal resistance

136

143

205

°C/W

Junction-to-case (top) thermal resistance

74

47

200

°C/W

Junction-to-board thermal resistance

62

64

113

°C/W

Junction-to-top characterization parameter

19.7

5.3

38.2

°C/W

Junction-to-board characterization parameter

54.8

62.8

104.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W