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ISL6552 Datasheet(PDF) 14 Page - Renesas Technology Corp

Part No. ISL6552
Description  Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL6552 Datasheet(HTML) 14 Page - Renesas Technology Corp

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ISL6552
FN4918 Rev 2.00
Page 14 of 18
July 2004
Example: From the previous conditions,
where: ILT
= 100A,
ISAMPLE
= 25.49A,
rDS(ON) (Q2)
= 4m
Then:
RISEN
= 2.04K and
ICURRENT TRIP = 165%
Short circuit ILT = 165A.
Channel Frequency Oscillator
The channel oscillator frequency is set by placing a resistor,
RT, to ground from the FS/DIS pin. Figure 10 is a curve
showing the relationship between frequency, FSW, and resistor
RT. To avoid pickup by the FS/DIS pin, it is important to place
this resistor next to the pin.
Layout Considerations
MOSFETs switch very fast and efficiently. The speed with which
the current transitions from one device to another causes voltage
spikes across the interconnecting impedances and parasitic
circuit elements. These voltage spikes can degrade efficiency,
radiate noise into the circuit and lead to device over-voltage
stress. Careful component layout and printed circuit design
minimizes the voltage spikes in the converter. Consider, as an
example, the turnoff transition of the upper PWM MOSFET. Prior
to turnoff, the upper MOSFET was carrying channel current.
During the turnoff, current stops flowing in the upper MOSFET
and is picked up by the lower MOSFET. Any inductance in the
switched current path generates a large voltage spike during the
switching interval. Careful component selection, tight layout of the
critical components, and short, wide circuit traces minimize the
magnitude of voltage spikes. Contact Intersil for evaluation board
drawings of the component placement and printed circuit board.
There are two sets of critical components in a DC-DC
converter using a ISL6552 controller and a HIP6601 gate
driver. The power components are the most critical because
they switch large amounts of energy. Next are small signal
components that connect to sensitive nodes or supply critical
bypassing current and signal coupling.
The power components should be placed first. Locate the input
capacitors close to the power switches. Minimize the length of
the connections between the input capacitors, CIN, and the
power switches. Locate the output inductors and output
capacitors between the MOSFETs and the load. Locate the
gate driver close to the MOSFETs.
The critical small components include the bypass capacitors
for VCC and PVCC on the gate driver ICs. Locate the bypass
capacitor, CBP, for the ISL6552 controller close to the device.
It is especially important to locate the resistors associated with
the input to the amplifiers close to their respective pins, since
they represent the input to feedback amplifiers. Resistor RT,
that sets the oscillator frequency should also be located next to
the associated pin. It is especially important to place the RSEN
resistors at the respective terminals of the ISL6552.
A multi-layer printed circuit board is recommended. Figure 11
shows the connections of the critical components for one output
channel of the converter. Note that capacitors CIN and COUT
could each represent numerous physical capacitors. Dedicate
one solid layer, usually the middle layer of the PC board, for a
ground plane and make all critical component ground
connections with vias to this layer. Dedicate another solid layer
as a power plane and break this plane into smaller islands of
common voltage levels. Keep the metal runs from the PHASE
terminal to output inductor short. The power plane should
support the input power and output power nodes. Use copper
filled polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small signal
wiring. The wiring traces from the driver IC to the MOSFET gate
and source should be sized to carry at least one ampere of
current.
Component Selection Guidelines
Output Capacitor Selection
The output capacitor is selected to meet both the dynamic load
requirements and the voltage ripple requirements. The load
transient for the microprocessor CORE is characterized by
high slew rate (di/dt) current demands. In general, multiple
high quality capacitors of different size and dielectric are
paralleled to meet the design constraints.
Modern microprocessors produce severe transient load rates.
High frequency capacitors supply the initially transient current
and slow the load rate-of-change seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by the
ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
50
100
10
20
200
500 1,000
5,000 10,000
2,000
1
2
5
10
20
50
100
200
500
1,000
CHANNEL OSCILLATOR FREQUENCY, FSW (kHz)
FIGURE 10. RESISTANCE RT vs FREQUENCY


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