CMV20000 datasheet(9/48 Pages) AMSCO

Part #	CMV20000

Description	20 Megapixel global shutter CMOS image sensor

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Manufacturer	AMSCO [ams AG]

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Reference:CMV20000-datasheet-v2.3

CMV20000 Datasheet

Page 8 of 47

2.1 PIXEL ARRAY

The CMV20000 sensor has 5120*3840 active pixels with a 6.4um pitch surrounded by two dummy rows and columns.

These dummy pixels at the side will ensure that the optical performance, of the active pixels at the edges, is the same

as the one in the active array. These dummy pixels cannot be read out and will be set permanent into reset. The pixels

are designed to achieve maximum sensitivity with low noise and low PLS specifications. Micro lenses are placed on top

of the pixels for improved fill factor and quantum efficiency.

2.2 ANALOG FRONT-END ELECTRONICS (AFE)

The analog front end consists of 2 major parts, a column amplifier block and a column ADC block.

The column amplifier prepares the pixel signal for the column ADC and applies analog gain if desired (programmable

using the SPI interface). The column ADC converts the analog pixel value to a 12 bit value and can apply a gain. A

digital offset can also be applied to the output of the column ADC’s. All gain and offset settings can be programmed

using the SPI interface.

2.3 LVDS BLOCK

The LVDS block converts the digital data coming from the column ADC into standard serial LVDS data running at

maximum 480Mbps. The sensor has 18 LVDS output pairs:



16 data channels



1 control channel



1 clock channel

The 16 data channels are used to transfer 12-bit data words from sensor to receiver. The output clock channel

transports a DDR clock, synchronous to the data on the other LVDS channels. This clock can be used at the receiving

end to sample the data. The data on the control channel contains status information on the validity of the data on the

data channels, among other useful sensor status information. Details on the LVDS timing and format can be found in

section 4 of this document.

2.4 SEQUENCER

The on-chip sequencer will generate all required control signals to operate the sensor from only a few external control

clocks. This sequencer can be activated and programmed through the SPI interface. A detailed description of the SPI

registers and sensor (sequencer) programming can be found in section 5 of this document.

2.5 SPI

The SPI interface is used to load the sequencer registers with data. The data in these registers is used by the

sequencer while driving and reading out the image sensor. Features like windowing, sub sampling, gain and offset are

programmed using this interface. The data in the on-chip registers can also be read back for test and debug of the

surrounding system. Section 5 contains more details on register programming and SPI timing.

2.6 TEMPERATURE SENSOR

A 16-bit digital temperature sensor is included in the image sensor and can be controlled by the SPI-interface. The on-

chip temperature can be obtained by reading out a dedicated SPI register (address 101-102).

A calibration of the temperature sensor is needed by the surrounding system (for absolute temperature

measurements).

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