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TEA1541 Datasheet(PDF) 2 Page - NXP Semiconductors |
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TEA1541 Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 19 page 2003 Aug 11 2 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 CONTENTS 1 FEATURES 1.1 Distinctive features 1.2 Green features 1.3 Protection features 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING 6 FUNCTIONAL DESCRIPTION 6.1 Start-up, mains voltage-dependent operation-enabling level and undervoltage lock-out 6.2 Supply management 6.3 Primary current regulation 6.4 Oscillator 6.5 Demagnetization 6.6 Minimum and maximum ‘on-time’ 6.7 Overvoltage protection 6.8 Overcurrent protection and overpower protection 6.9 Soft start 6.10 Winding short-circuit protection 6.11 Overtemperature protection 6.12 Burst standby mode 6.13 Driver 7 LIMITING VALUES 8 THERMAL CHARACTERISTICS 9 QUALITY SPECIFICATION 10 CHARACTERISTICS 11 APPLICATION INFORMATION 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction to soldering through-hole mount packages 13.2 Soldering by dipping or by solder wave 13.3 Manual soldering 13.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS |
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