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PC7457 Datasheet(PDF) 44 Page - ATMEL Corporation |
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PC7457 Datasheet(HTML) 44 Page - ATMEL Corporation |
44 / 66 page 44 PC7457/47 [Preliminary] 5345B–HIREL–02/04 Substrate Capacitors for the PC7447, 360 CBGA Figure 26 shows the connectivity of the substrate capacitor pads for the PC7447, 360 CBGA. All capacitors are 100 nF. Figure 26. Substrate Bypass Capacitors for the PC7447, 360 CBGA Package Parameters for the PC7457, 483 CBGA The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483-lead ceramic ball grid array (CBGA). Package outline 29 mm × 29 mm Interconnects 483 (22 × 22 ball array - 1) Pitch 1.27 mm (50 mil) Minimum module height – Maximum module height 3.22 mm Ball diameter 0.89 mm (35 mil) C1-2 C1-1 C2-1 C3-1 C4-1 C5-1 C6-1 C6-2 C5-2 C4-2 C3-2 C2-2 C18-1 C18-2 C17-2 C16-2 C15-2 C14-2 C13-2 C13-1 C14-1 C15-1 C16-1 C17-1 A1 CORNER C1 GND VDD C2 GND VDD C3 GND OVDD C4 GND VDD C5 GND VDD C6 GND VDD C7 GND VDD C8 GND VDD C9 GND OVDD C10 GND VDD C11 GND VDD C12 GND VDD C13 GND VDD C14 GND VDD C15 GND VDD C16 GND OVDD C17 GND VDD C18 GND OVDD C19 GND VDD C20 GND VDD C21 GND OVDD C22 GND VDD C23 GND VDD C24 GND VDD Capacitor Pad Number -1 -2 |
Similar Part No. - PC7457 |
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Similar Description - PC7457 |
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