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3

Package Outlines

1

8

7

2

6

3

4

5

2

3

8

6

1

4

7

5

Figure 2. 3x3 mm MLP-8 (Top View )

Figure 3. SOIC-8 (Top View )

Thermal Characteristics

(2)

Package

Θ

JL

(3)

Θ

JT

(4)

Θ

JA

(5)

Ψ

JB

(6)

Ψ

JT

(7)

Unit

8-Lead 3x3 mm Molded Leadless Package (MLP)

1.6

68

43

3.5

0.8

°C/W

8-Pin Small Outline Integrated Circuit (SOIC)

40

31

89

43

3.0

°C/W

Notes:

2.

Estimates derived from thermal simulation; actual values depend on the application.

3.

Theta_JL (

Θ

thermal pad) that are typically soldered to a PCB.

4.

Theta_JT (

Θ

held at a uniform temperature by a top-side heatsink.

5.

Theta_JA (

Θ

The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,

JESD51-5, and JESD51-7, as appropriate.

6.

Psi_JB (

Ψ

application circuit board reference point for the thermal environment defined in Note 5. For the MLP-8 package, the board

reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the

SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.

7.

Psi_JT (

Ψ

the center of the top of the package for the thermal environment defined in Note 5.