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LTM8057 Datasheet(PDF) 2 Page - Linear Technology |
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LTM8057 Datasheet(HTML) 2 Page - Linear Technology |
2 / 20 page LTM8046 2 8046fb For more information www.linear.com/LTM8046 pin conFiguraTion absoluTe MaxiMuM raTings VIN, RUN ...................................................................32V FB, SS .........................................................................5V VOUT Relative to VOUT–..............................................16V VIN + 2VOUT (Note 5).................................................36V BIAS................................................................ VIN + 0.1V GND to VOUT– Isolation (Note 2) ...........................2kVAC Maximum Internal Temperature (Note 3) .............. 125°C Peak Solder Reflow Body Temperature ................. 245°C (Note 1) L K J H G F E D C B A TOP VIEW 1 2 3 4 5 6 7 BANK 4 VOUT BANK 3 VOUT– BANK 2 GND RUN FB BIAS SS BANK 1 VIN BGA PACKAGE 51-LEAD (15mm × 9mm × 4.92mm) TJMAX = 125°C, θJA = 21.9°C/W, θJCbottom = 7.9°C/W, θJCtop = 17.9°C/W, θJB = 8.4°C/W WEIGHT = 1.5g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12 orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (See Note 3) DEVICE FINISH CODE LTM8046EY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –40°C to 125°C LTM8046IY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –40°C to 125°C LTM8046IY SnPb (63/37) LTM8046Y e0 BGA 3 –40°C to 125°C LTM8046MPY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –55°C to 125°C LTM8046MPY SnPb (63/37) LTM8046Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Pb-free and Non-Pb-free Part Markings: www.linear.com/leadfree • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear.com/umodule/pcbassembly • LGA and BGA Package and Tray Drawings: www.linear.com/packaging |
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