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LTM4636 Datasheet(PDF) 10 Page - Linear Technology |
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LTM4636 Datasheet(HTML) 10 Page - Linear Technology |
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10 / 38 page  LTM4650A 10 4650afb For more information www.linear.com/LTM4650A PIN FUNCTIONS DIFFOUT (F8): Internal Remote Sense Amplifier Output. Connect this pin to VOUTS1 or VOUTS2 depending on which output is using remote sense. In parallel operation con- nect one of the VOUTS pin to DIFFOUT for remote sensing. SW1, SW2 (G2, G11): Switching node of each channel that is used for testing purposes. Also an R-C snubber network can be applied to reduce or eliminate switch node ringing, or otherwise leave floating. See the Applications Information section. PHASMD(G4):ConnectthispintoSGND,INTVCC,orfloat- ing this pin to select the phase of CLKOUT to 60 degrees, 120 degrees, and 90 degrees respectively. CLKOUT (G5): Clock output with phase control using the PHASMD pin to enable multiphase operation between devices. See the Applications Information section. PGOOD1, PGOOD2 (G9, G8): Output Voltage Power Good Indicator. Open drain logic output that is pulled to ground when the output voltage is not within ±10% of the regulation point. INTVCC (H8): Internal 5V Regulator Output. The control circuits and internal gate drivers are powered from this voltage. Decouple this pin to PGND with a 4.7µF low ESR tantalumorceramic.INTVCCisactivatedwheneitherRUN1 or RUN2 is activated. TEMP (J6): Temperature Monitor. An internal diode con- nectedNPNtransistorconnectedbetweenTEMPandSGND pins. See the Applications Information section. EXTVCC (J7): External power input that is enabled through a switch to INTVCCwhenever EXTVCC is greater than 4.7V. Do not exceed 6V on this input, and connect this pin to VIN when operating VIN on 5V. An efficiency increase will occur that is a function of the (VIN – INTVCC) multiplied by powerMOSFETdrivercurrent.Typicalcurrentrequirement is 30mA. VIN must be applied before EXTVCC, and EXTVCC must be removed before VIN. VIN(M2–M11,L2–L11,J2–J4,J9–J11,K2–K4,K9–K11): Power Input Pins. Apply input voltage between these pins and GND pins. Recommend placing input decoupling capacitance directly between VIN pins and GND pins. Heat Sink (Top Exposed Metal): The top exposed metal is electrically unconnected. (Recommended to Use Test Points to Monitor Signal Pin Connections.) |
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