© 2004 California Micro Devices Corp. All rights reserved.

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CM3106

Performance Information (cont’d)

Typical Thermal Characteristics (cont’d) (nominal conditions unless otherwise specified)

The theoretical calculations of these relationships

show the safe operating area of the CM3106 in the

SOIC package.

Thermal characteristics were measured using a double

sided board with two square inches of copper area

connected to the GND pins for "heat spreading".

Measurements showing performance up to a junction

temperature of 150°C were performed under light load

conditions (5mA). This allows the ambient temperature

to be representative of the internal junction tempera-

ture.

Note: The use of multi-layer board construction with

separate ground and power planes will further enhance

the overall thermal performance.

Figure 12. Reference Voltage vs. Temperature

(5mA load)