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6N134 Datasheet(PDF) 6 Page - Agilent(Hewlett-Packard)

Part No. 6N134
Description  Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers
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Maker  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
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6N134 Datasheet(HTML) 6 Page - Agilent(Hewlett-Packard)

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Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Input Current, Low Level, Each Channel
IFL
0
250
µA
Input Current, High Level, Each Channel*
IFH
10
20
mA
Supply Voltage, Output
VCC
4.5
5.5
V
Fan Out (TTL Load) Each Channel
N
6
*Meets or exceeds DSCC SMD and JEDEC requirements.
Absolute Maximum Ratings
(No derating required up to +125
°C)
Storage Temperature Range, TS ................................... -65°C to +150°C
Operating Temperature, TA .......................................... -55°C to +125°C
Case Temperature, TC ................................................................+170°C
Junction Temperature, TJ ........................................................... +175°C
Lead Solder Temperature ............................................... 260
°C for 10 s
Peak Forward Input Current, IFPK, (each channel,
≤ 1 ms duration) ...................................................................... 40 mA
Average Input Forward Current, IFAVG (each channel) ................ 20 mA
Input Power Dissipation (each channel) ..................................... 35 mW
Reverse Input Voltage, VR (each channel) ......................................... 5 V
Supply Voltage, VCC (1 minute maximum) ........................................ 7 V
Output Current, IO (each channel) ............................................... 25 mA
Output Power Dissipation (each channel) .................................. 40 mW
Output Voltage, VO (each channel) .................................................. 7 V*
Package Power Dissipation, PD (each channel) ........................ 200 mW
*Selection for higher output voltages up to 20 V is available.
Single Channel Product Only
Emitter Input Voltage, VE ............................................................... 5.5 V
Note enable pin 7. An external
0.01
µF to 0.1 µF bypass
capacitor must be connected
between VCC and ground for each
package type.
8 Pin Ceramic DIP Single Channel Schematic
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5600/01/0K ............................................................... (
∆), Class 1
6N134, 6N134/883B, HCPL-5630/31/3K, HCPL-5650/51,
HCPL-6630/31/3K and HCPL-6650/51/5K ....................... (Dot), Class 3


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