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13

per F orman C e C hara CT eri ST i CS

Test Items Performance

Test Methods

Short time overload

±(1.0%+0.5mΩ)

P= 2.5Pr; T=25 ±2ºC, t=5sec.; IEC60115-1 4.13

High Temp. Exposure

±(1.0%+0.5mΩ)

T=+170 ±2ºC; t=1000h; IEC60115-1 4.25

Low Temp. Storage

±(1.0%+0.5mΩ)

T=-55 ±2ºC; t=1000h; IEC60115-1 4.25

Moisture Load Life

±(2.0%+0.5mΩ)

Vtest=Vmax; T=60 ±2ºC; RH=95%; t= 90min ON, 30min OFF, 1000h; IEC60115-1 4.25

(60℃, 95%RH)

Thermal Shock

±(1.0%+0.5mΩ)

-55ºC 30min. / R.T. 3min. / +150ºC 30min. / R.T. 3min ], 100cycles; IEC60115-1 4.19

Load Life at 70ºC

±(2%+0.5mΩ)

Vtest=Vmax; T=70 ±2ºC; t=90min ON; IEC60115-1 4.25

Solderability

The covered area >95% Dip into solder at T=245 ±5ºC, t=3 ±0.5sec.; IEC60115-1 4.17

Resistance to Solder Heat

±(1.0%+0.5mΩ)

Through Reflow T=275 ±5ºC, t=20 ±1sec.; IEC60115-1 4.18

Mechanical Shock

±(1.0%+0.5mΩ)

a=100G, t=11ms, 5 times shock; IEC60115-1 4.21

Substrate Bending

±(1.0%+0.5mΩ)

Span between fulcrums 90mm; bend width 2mm; test board glass-epoxy;

Thickness=1.6mm; IEC60115-1 4.33

FC4T Series

Metal Foil Low Value Chip

dimen S ion S

(mm ±0.2)

A

N

A

B

P

E

F

W

P

T

K

Direction

of feed

W

a

g

b

c

d

e

L

t

f

Tape and Reel

Part

L

W

a

b

c

t

d

e

f

g

FC4T 3.2

1.6

0.6

0.55

0.3

0.6

1.10 0.30

1.2

1.8

Part

W

P

P2

A

B

D0

F

E

T

T1

K

FC4T 8.00 ±0.30 4.00 ±0.10

2.00 ±0.10 2.05 ±0.20 3.65 ±0.20 1.50 ±0.10 3.50 ±0.10 1.75 ±0.10 0.20 ±0.10

Max. 0.1

0.85 ±0.20

A

178 ±5

N

60 ±2

W1 9 ±1

orderin G in F ormaT ion

Series

Tolerance

F= 1%

D= 0.5%

Ohms

Tape & Reel

5000/reel

RoHS Compliant

1%

FC4TR005FER

FC4TR010FER

FC4TR015FER

FC4TR050FER

FC4TR100FER

0.5%

FC4TR010DER

FC4TR015DER

FC4TR050DER

FC4TR100DER

Standard Part Numbers

rev 1/18-3

V = sensing terminal

(voltage)

I = current terminal

VV

II

Schematic

Layout for

illustration only,

part can be

rotated 180°

without effect to

the circuit.