PRELIMINARY

Rev 0.9

Page 5 of 7

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Dimensions and Patterns

Package Size

– Dimensions (Unit: mm)

Recommended Land Pattern (Unit: mm)

#1

#2

#4

#3

(soldermask openings shown with

dashed line around NSMD pad)

Recommended 4-mil (0.1mm) stencil thickness

Manufacturing Guidelines

1) No Ultrasonic or Megasonic cleaning: Do not subject SiT1572 to an ultrasonic or megasonic cleaning environment.

Permanent damage or long term reliability issues may occur.

2) Applying board-level underfill and overmold is acceptable and will not impact the reliability of the device.

3) Reflow profile, perJESD22-A113D.

4) The SiT1572 CSP includes a protective, opaque polymer top-coat. If the SiT1572 will see intense light, especially in the

1.0-1.2

µm IR spectrum, we recommend a protective “glob-top” epoxy or other cover to keep the light from negatively

impacting the frequency stability.

5) For additional manufacturing guidelines and marking/tape-reel instructions, refer to SiTime Manufacturing Notes.