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CY7C1472V33-167AXI Datasheet(PDF) 8 Page - Cypress Semiconductor

Part # CY7C1472V33-167AXI
Description  72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1472V33-167AXI Datasheet(HTML) 8 Page - Cypress Semiconductor

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PRELIMINARY
CY7C1470V33
CY7C1472V33
CY7C1474V33
Document #: 38-05289 Rev. *E
Page 8 of 28
Write Cycle Description table for details) inputs is latched into
the device and the write is complete.
The data written during the Write operation is controlled by BW
(BWa,b,c,d,e,f,g,h
for
CY7C1474V33,
BWa,b,c,d
for
CY7C1470V33 and BWa,b for CY7C1472V33) signals. The
CY7C1470V33/CY7C1472V33/CY7C1474V33 provides Byte
Write capability that is described in the Write Cycle Description
table. Asserting the Write Enable input (WE) with the selected
Byte Write Select (BW) input will selectively write to only the
desired bytes. Bytes not selected during a Byte Write
operation will remain unaltered. A synchronous self-timed
Write mechanism has been provided to simplify the Write
operations. Byte Write capability has been included in order to
greatly simplify Read/Modify/Write sequences, which can be
reduced to simple Byte Write operations.
Because the CY7C1470V33/CY7C1472V33/CY7C1474V33
are common I/O devices, data should not be driven into the
device while the outputs are active. The Output Enable (OE)
can be deasserted HIGH before presenting data to the DQ and
DQP
(DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474V33,
DQa,b,c,d/DQPa,b,c,d for CY7C1470V33 and DQa,b/DQPa,b for
CY7C1472V33) inputs. Doing so will tri-state the output
drivers. As a safety precaution, DQ and DQP (DQa,b,c,d,e,f,g,h/
DQPa,b,c,d,e,f,g,h for CY7C1474V33, DQa,b,c,d/ DQPa,b,c,d for
CY7C1470V33 and DQa,b/DQPa,b for CY7C1472V33) are
automatically tri-stated during the data portion of a Write cycle,
regardless of the state of OE.
Burst Write Accesses
The CY7C1470V33/CY7C1472V33/CY7C1474V33 has an
on-chip burst counter that allows the user the ability to supply
a single address and conduct up to four Write operations
without reasserting the address inputs. ADV/LD must be
driven LOW in order to load the initial address, as described
in the Single Write Access section above. When ADV/LD is
driven HIGH on the subsequent clock rise, the Chip Enables
(CE1, CE2, and CE3) and WE inputs are ignored and the burst
counter is incremented. The correct BW (BWa,b,c,d,e,f,g,h for
CY7C1474V33, BWa,b,c,d for CY7C1470V33 and BWa,b for
CY7C1472V33) inputs must be driven in each cycle of the
burst write in order to write the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE1, CE2, and CE3, must remain inactive
for the duration of tZZREC after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address
Second
Address
Third
Address
Fourth
Address
A1,A0
A1,A0
A1,A0
A1,A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Linear Burst Address Table
(MODE = GND)
First
Address
Second
Address
Third
Address
Fourth
Address
A1,A0
A1,A0
A1,A0
A1,A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
ZZ Mode Electrical Characteristics
Parameter
Description
Test Conditions
Min.
Max
Unit
IDDZZ
Sleep mode standby current
ZZ
> V
DD − 0.2V
120
mA
tZZS
Device operation to ZZ
ZZ
> V
DD − 0.2V
2tCYC
ns
tZZREC
ZZ recovery time
ZZ
< 0.2V
2tCYC
ns
tZZI
ZZ active to sleep current
This parameter is sampled
2tCYC
ns
tRZZI
ZZ Inactive to exit sleep current
This parameter is sampled
0
ns


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