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CY62137CV25/30/33 MoBL®
CY62137CV MoBL®
Document #: 38-05201 Rev. *D
Page 4 of 13
VIH
Input HIGH Voltage
2.2
VCC +
0.3V
2.2
VCC +
0.3V
V
VIL
Input LOW Voltage
–0.3
0.8
–0.3
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
–1
+1
µA
IOZ
Output Leakage Current
GND < VO < VCC, Output Dis-
abled
–1
+1
–1
+1
µA
ICC
VCC Operating Supply Current f = fMAX = 1/tRC
VCC = 3.6V
IOUT = 0 mA
CMOS
Levels
7
15
5.5
12
mA
f = 1 MHz
1.5
3
1.5
3
ISB1
Automatic CE
Power-down Current —CMOS
Inputs
CE > VCC – 0.2V
VIN > VCC – 0.2V or VIN < 0.2V,
f = fmax (Address and Data Only),
f=0 (OE, WE, BHE, and BLE)
5
15
5
15
µA
ISB2
Automatic CE
Power-down Current —CMOS
Inputs
CE > VCC – 0.2V
VIN > VCC – 0.2V or VIN <
0.2V,
f = 0, VCC = 3.6V
LL
5
15
5
15
SL
1
5
Electrical Characteristics Over the Operating Range (continued)
Parameter
Description
Test Conditions
CY62137CV33-55
CY62137CV33-70
CY62137CV-70
Unit
Min. Typ.[5] Max.
Min. Typ.[5] Max.
Capacitance[6]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC = VCC(typ.)
6
pF
COUT
Output Capacitance
8
pF
Thermal Resistance
Parameter
Description
Test Conditions
BGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)[6]
Still Air, soldered on a 3 x 4.5 inch, two-layer printed
circuit board
55
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)[6]
16
°C/W
AC Test Loads and Waveforms
VCC Typ
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
VTH
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
Rise TIme: 1 V/ns
Fall Time: 1 V/ns
Parameters
2.5V
3.0V
3.3V
Unit
R1
16600
1105
1216
Ω
R2
15400
1550
1374
Ω
RTH
8000
645
645
Ω
VTH
1.20
1.75
1.75
V
Note:
6.
Tested initially and after any design or process changes that may affect these parameters.
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