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NCV8537ML500R2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCV8537ML500R2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 16 page NCV8537 www.onsemi.com 4 PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1, 2 Vout Regulated output voltage. Bypass to ground with Cout w 1.0 mF 3 SENSE/ADJ For output voltage sensing, connect to Pins 1 and 2.at Fixed output Voltage version Adjustable pin at Adjustable output version 4 GND Power Supply Ground 5 PWRG Power Good 6 NC Not Connected 7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise. 8 SD Shutdown pin. When not in use, this pin should be connected to the input pin. 9, 10 Vin Power Supply Input Voltage EPAD EPAD Exposed thermal pad should be connected to ground. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin −0.3 to +16 V Output Voltage Vout −0.3 to Vin +0.3 or 10 V* V PWRG Pin Voltage VPWRG −0.3 to +16 V Shutdown Pin Voltage Vsh −0.3 to +16 V Junction Temperature Range TJ −40 to +150 °C Storage Temperature Range Tstg −50 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114) Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115) Charged Device Model (CDM) tested per EIA/JESD22−C101. *Which ever is less. Reverse bias protection feature valid only if (Vout − Vin) ≤ 7 V. THERMAL CHARACTERISTICS Characteristic Test Conditions (Typical Value) Unit Min Pad Board (Note 1) 1 , Pad Board (Note 1) Junction−to−Air, qJA 215 66 °C/W Junction−to−Pin, J−L4 58 18 °C/W 1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions are under natural convection or zero air flow. |
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