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CM3003-18 Datasheet(PDF) 10 Page - California Micro Devices Corp |
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CM3003-18 Datasheet(HTML) 10 Page - California Micro Devices Corp |
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10 / 11 page  © 2004 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/15/04 CM3003 Performance Information (cont’d) CM3003 Typical Thermal Characteristics The overall junction to ambient thermal resistance ( θ JA) for device power dissipation (PD) consists prima- rily of two paths in series. The first path is the junction to the case ( θ JC) which is defined by the package style, and the second path is case to ambient ( θ CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of con- ditions can be estimated by the following thermal equa- tion: TJUNC = TAMB + PD ( θ JC) + PD ( θ CA) = TAMB + PD (θJA) The CM3003 uses a thermally enhanced package where all the GND pins (5 through 8) are integral to the leadframe. When this package is mounted on a double sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting θ JA is about 50°C/W. Based on a typical operating power dissipation of 1.0W (3.0V-2.5Vx 2.0A) with an ambient of 70°C, the result- ing junction temperature will be: TJUNC = TAMB + PD ( θ JA) = 70°C + 1.0W X (50°C/W) = 70°C + 50°C = 120°C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pin for "heat spreading". Measurements showing performance up to junction temperature of 125°C were performed under light load conditions (5mA). This allows the ambient temperature to be representative of the internal junction tempera- ture. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction, using only the minimum size pad layout, will provide the CM3003 with an overall θ JA of 70°C/W which allows up to 800mW to be safely dissipated for the maximum junction temperature. Internal Reference Voltage over Temperature 1.17 1.18 1.19 1.20 1.21 1.22 0 25 50 75 100 125 150 TEMPERATURE [ oC] Output Voltage (2.5V) over Temperature 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 0 25 50 75 100 125 150 TEMPERATURE [ oC] 5mA Load Ground Current over Temperature 300 310 320 330 340 350 0 25 50 75 100 125 150 TEMPERATURE [ oC] |
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Similar Description - CM3003-18 |
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