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AD8392 Datasheet(PDF) 5 Page - Analog Devices

Part No. AD8392
Description  Low Power, High Output Current, Quad Op Amp, Dual-Channel ADSL/ADSL2 Line Driver
Download  16 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

AD8392 Datasheet(HTML) 5 Page - Analog Devices

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AD8392
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
±13 V (+26 V)
Power Dissipation
See Figure 3
Storage Temperature
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature Range (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, i.e., θJA is specified
for device soldered in circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
Unit
LFCSP-32 (CP)
27.27
°C/W
TSSOP-28/EP (RE)
35.33
°C/W
Maximum Power Dissipation
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load (RL) is midsupply,
the total drive power is VS/2 × IOUT, some of which is
dissipated in the package and some in the load (VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced
to VS− as in single-supply operation, the total power is VS × IOUT.
In single supply with RL to VS−, worst case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. Also,
more metal directly in contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
Figure 3 shows the maximum safe power dissipation in the
package versus the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board. θJA
values are approximations.
0
1
2
3
4
5
6
7
–40 –30 –20 –10
0
1020
3040
5060
7080
90
TEMPERATURE (
°C)
TJ = 150°C
LFCSP-32
TSSOP-28/EP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.


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