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NCV8133 Datasheet(PDF) 10 Page - ON Semiconductor |
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NCV8133 Datasheet(HTML) 10 Page - ON Semiconductor |
10 / 11 page NCV8133 www.onsemi.com 10 Power Dissipation The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. For reliable operation, junction temperature should be limited to +125 °C. ORDERING INFORMATION Device Nominal Output Voltage Marking Option Package Shipping† NCV8133BMX080TCG 0.80 V JL Non−Active Discharge XDFN6 (Pb−Free) 3000 / Tape & Reel NCV8133BMX100TCG 1.00 V JM NCV8133BMX110TCG 1.10 V JD NCV8133BMX120TCG 1.20 V JE NCV8133BMX130TCG 1.30 V JN NCV8133BMX150TCG 1.50 V JF NCV8133BMX180TCG 1.80 V JG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe- cifications Brochure, BRD8011/D. To order other package and voltage variants, please contact your ON Semiconductor sales representative |
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