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NSS35200CF8T1G Datasheet(PDF) 1 Page - ON Semiconductor

Part No. NSS35200CF8T1G
Description  High Current Surface Mount PNP Silicon Low VCE-SAT Switching Transistor for Load Management in Portable Applications
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NSS35200CF8T1G Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2005
April, 2005 − Rev. 2
1
Publication Order Number:
NSS35200CF8T1G/D
NSS35200CF8T1G
High Current Surface Mount
PNP Silicon Low VCE−SAT
Switching Transistor for
Load Management in
Portable Applications
This is a Pb−Free Device
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
Collector-Emitter Voltage
VCEO
−35
Vdc
Collector-Base Voltage
VCBO
−55
Vdc
Emitter-Base Voltage
VEBO
−5.0
Vdc
Collector Current − Continuous
IC
−2.0
Adc
Collector Current − Peak
ICM
−7.0
A
Electrostatic Discharge
ESD
HBM Class 3
MM Class C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25
°C
PD (Note 1)
635
5.1
mW
mW/
°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 1)
200
°C/W
Total Device Dissipation
TA = 25°C
Derate above 25
°C
PD (Note 2)
1.35
11
W
mW/
°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 2)
90
°C/W
Thermal Resistance,
Junction−to−Lead #1
RqJL
15
°C/W
Total Device Dissipation
(Single Pulse < 10 sec)
PDsingle
(Notes 2 & 3)
2.75
W
Junction and Storage
Temperature Range
TJ, Tstg
−55 to
+150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR− 4 @ 100 mm2, 1 oz copper traces.
2. FR− 4 @ 500 mm2, 1 oz copper traces.
3. Thermal response.
COLLECTOR
1, 2, 3, 6, 7, 8
4
BASE
5
EMITTER
35 VOLTS
2.0 AMPS
PNP TRANSISTOR
http://onsemi.com
Device
Package
Shipping
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ChipFET
]
CASE 1206A
STYLE 4
MARKING
DIAGRAM
1
2
3
4
C
C
C
B
C
C
C
E
PIN
CONNECTIONS
8
7
6
5
5
6
7
81
2
3
4
G4 = Specific Device Code
M = Month Code
NSS35200CF8T1G
ChipFET
(Pb−Free)
3000/
Tape & Reel


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