© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 09/14/17

Industrial High Energy Terminal Varistors > DHB34 Series

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (Ts(min))

150°C

- Temperature Max (Ts(max))

200°C

- Time (min to max) (ts)

60 – 180 secs

Average ramp up–rate (Liquidus Temp (TL)

to peak

5°C/second max

TS(max) to TL - Ramp-up Rate

5°C/second max

Reflow

- Temperature (TL) (Liquidus)

217°C

- Temperature (tL)

60 – 150 seconds

Peak Temperature (TP)

Time within 5°C of actual peak

Temperature (tp)

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peak Temperature (TP)

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Operating/Storage

Temperature

-55°C to +85°C/-55°C to +125°C

Humidity Aging

+85°C, 85% RH, 1000 hours

+/-10% Voltage change

Thermal Shock

+85°C to -40°C 5 times

+/-10% Voltage change

Solvent Resistance

MIL–STD–202, Method 215

Moisture Sensitivity

Level 1, J-STD-020

Lead Material

Tin–coated Copper

Soldering

Characteristics

Solderability per MIL–STD–202,

Method 208

Insulating Material

Cured, flame retardant epoxy polymer

meets UL94V–0 requirements.

Device Labeling

Marked with LF, voltage, amperage rating,

and date code.

Physical Specifications

Environmental Specifications

Lead–free Profile

Non Lead–free Profile

0

50

100

150

200

250

300

00.5

11.5

22.5

33.5

4

TIME(MINUTES)

Maximum Wave 240C

0

50

100

150

200

250

300

00.5

11.5

22.5

33.5

4

TIME(MINUTES)

Maximum Wave 260C

Figure 5

Figure 6