NCV8163

www.onsemi.com

2

Figure 2. Simplified Schematic Block Diagram

IN

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

INTEGRATED

SOFT−START

BANDGAP

REFERENCE

ENABLE

LOGIC

EN

OUT

GND

EN

* ACTIVE DISCHARGE

Version A only

PIN FUNCTION DESCRIPTION

Pin No.

TSOP−5

Pin No.

XDFN4

Pin

Name

Description

1

4

IN

Input voltage supply pin

5

1

OUT

Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.

3

3

EN

2

2

GND

Common ground connection

4

−

N/C

Not connected. This pin can be tied to ground to improve thermal dissipation.

−

EP

EPAD

Exposed Pad. Exposed pad can be tied to ground plane for better power dissipation.

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

−0.3 V to 6

V

Output Voltage

V

Chip Enable Input

−0.3 to 6 V

V

Output Short Circuit Duration

unlimited

s

Operating Ambient Temperature Range

−40 to +125

°C

Maximum Junction Temperature

150

°C

Storage Temperature Range

−55 to +150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

ESD Capability, Charged Device Model (Note 2)

1000

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

ESD Charged Device Model tested per EIA/JESD22−C101, Field Induced Charge Model

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

RECOMMENDED OPERATING CONDITIONS

Rating

Symbol

Min

Max

Unit

Input Voltage

2.2

5.5

V

Junction Temperature

−40

+125

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.